



WZ-D15
The WZ-D15 is a dual-track AOI system designed for SMT dual-line production. Equipped with two independently adjustable conveyors, it seamlessly connects dual-track pick-and-place machines and reflow ovens to enable parallel PCB transport. Both tracks operate independently, supporting simultaneous inspection of identical products or separate detection of different models and sizes. It accommodates pre-reflow component placement checks and post-reflow solder joint inspections. Leveraging machine vision algorithms, it identifies defects such as missing components, misalignment, tombstoning, cold joints, and solder bridges. Inspection data is recorded separately and can integrate with MES systems for quality traceability and SPC analysis. Compared to two single-track AOIs, this dual-track solution offers a smaller footprint, lower investment costs, and doubled throughput in a single unit. By significantly boosting inspection capacity and reducing manual visual checks, it meets the demands of high-volume SMT lines and helps enterprises improve efficiency and quality.
Key Features
Ultra-High-Precision Detection
2800-megapixel camera with sub-pixel algorithm, achieving detection accuracy of ±0.003mm
3D Topography Analysis
Multi-angle structured light projection for precise 3D reconstruction of weld bead morphology
AI Deep Learning
Proprietary neural network algorithms with continuous model optimization to effectively reduce false positives.
Smart Data Analytics
Built-in SPC statistical module for real-time quality report generation
Detection Results

3D Solder Joint Inspection
Precisely measure solder joint height, volume, and shape; identify various welding defects.

Micro-component Inspection
Supports detection of 01005 ultra-small components

BGA Solder Ball Inspection
High-precision detection of BGA solder ball missing, misalignment, and bridging
Application Areas
Technical Specifications
| Detection Accuracy | ±0.003mm |
| Detection Speed | ≤0.06s/ points |
| Camera Resolution | 2800 megapixels |
| Test visual field | 300mm × 230mm |
| Smallest Component | 01005 (Imperial) |
| BGA Inspection | Supports 0.25mm spacing |
| Power Requirements | AC 220V 50Hz |
| Device Dimensions | 1150×900×160 mm |
Actual specifications are subject to the confirmed model documentation.
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