WZ-D15
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SMT Series

WZ-D15

The WZ-D15 is a dual-track AOI system designed for SMT dual-line production. Equipped with two independently adjustable conveyors, it seamlessly connects dual-track pick-and-place machines and reflow ovens to enable parallel PCB transport. Both tracks operate independently, supporting simultaneous inspection of identical products or separate detection of different models and sizes. It accommodates pre-reflow component placement checks and post-reflow solder joint inspections. Leveraging machine vision algorithms, it identifies defects such as missing components, misalignment, tombstoning, cold joints, and solder bridges. Inspection data is recorded separately and can integrate with MES systems for quality traceability and SPC analysis. Compared to two single-track AOIs, this dual-track solution offers a smaller footprint, lower investment costs, and doubled throughput in a single unit. By significantly boosting inspection capacity and reducing manual visual checks, it meets the demands of high-volume SMT lines and helps enterprises improve efficiency and quality.

Key Features

Ultra-High-Precision Detection

2800-megapixel camera with sub-pixel algorithm, achieving detection accuracy of ±0.003mm

3D Topography Analysis

Multi-angle structured light projection for precise 3D reconstruction of weld bead morphology

AI Deep Learning

Proprietary neural network algorithms with continuous model optimization to effectively reduce false positives.

Smart Data Analytics

Built-in SPC statistical module for real-time quality report generation

Detection Results

3D Solder Joint Inspection

3D Solder Joint Inspection

Precisely measure solder joint height, volume, and shape; identify various welding defects.

Micro-component Inspection

Micro-component Inspection

Supports detection of 01005 ultra-small components

BGA Solder Ball Inspection

BGA Solder Ball Inspection

High-precision detection of BGA solder ball missing, misalignment, and bridging

Application Areas

Premium smartphonesSemiconductor PackagingMini LEDAutomotive ElectronicsAerospace

Technical Specifications

Detection Accuracy±0.003mm
Detection Speed≤0.06s/ points
Camera Resolution2800 megapixels
Test visual field300mm × 230mm
Smallest Component01005 (Imperial)
BGA InspectionSupports 0.25mm spacing
Power RequirementsAC 220V 50Hz
Device Dimensions1150×900×160 mm

Actual specifications are subject to the confirmed model documentation.

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