Transparent resin-encapsulated electronic circuit board module

Automotive Electronics

End-to-end quality control system to enhance automotive parts quality management

Industry Pain Points

Small, high-precision components with stringent manufacturing requirements.

Automotive electronics demand stringent quality; even minor scratches or damage are unacceptable.

Automotive electronics demand strict quality standards; even minor scratches or damage are unacceptable.

The board contains numerous non-standard components, making standard inspection difficult to support.

The board contains numerous non-standard components, making standard inspection difficult to accommodate.

High cleanliness standards for PCBs; all dirt and foreign objects must be detected.

High cleanliness standards for PCBs; all dirt and foreign objects must be fully detected.

Solutions

Automotive Electronic Visual Inspection Solution

AOI Inspection Equipment

WZ-3D AOI

01

3D Precision Imaging

Captures 3D data such as solder joint height, volume, and warpage to overcome 2D inspection limitations. Detects defects like cold joints and lead irregularities that are difficult to identify in 2D.

02

AI-Powered Rapid Coding

AI-powered coding uses deep learning to automatically identify board components and generate inspection programs, enabling rapid new model setup, reducing manual tuning, and minimizing changeover time.

03

Reliable and repeatable

Stable operation with high repeatability. Multiple scans of the same PCBA yield minimal variance, ensuring consistent quality assessment for automotive electronics and other products.

Solution Benefits

forAutomotive ElectronicsMore reliable security

Solution Benefits 1

Supports real-time HD imaging for both high-profile components and small parts. By adjusting the Z-axis height for specific FOVs and component types, it enhances screen printing image quality, supporting components up to 25mm in height.

Solution Benefits 2

Multi-angle projection combined with multi-frequency structured light fusion eliminates overexposure. Integrated AI denoising ensures highly accurate 3D reconstruction of the target object.

Solution Benefits 3

Optimize solder joint wetting preset parameters based on IPC standards to minimize manual tuning and effectively detect defects such as cold joints, insufficient solder, and excessive solder.

Solution Benefits 4

The intelligent solder ball detection algorithm eliminates the need for manual preprocessing to remove silkscreen interference, achieving higher recognition accuracy.

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