WZ-Q100
WZ-Q100 is designed for PCBA insertion production lines. Leveraging machine vision and AI algorithms, it automatically detects component insertion defects and solder joint issues, providing real-time online identification of anomalies. This reduces reliance on manual visual inspection, minimizes rework and scrap, and enables digital quality control for the insertion line. Its side-insertion design ensures easy and lightweight installation.
Key Features
Deep learning algorithms
Powered by our proprietary AI algorithms, it automatically learns defect features for high detection accuracy.
Multispectral Imaging
Equipped with a multi-angle lighting system to adapt to various weld surface characteristics, ensuring consistent inspection stability.
Smart MES Integration
Supports SPC statistical analysis and MES integration for quality data traceability.
One-click changeover
Changeover time under 5 minutes, supporting multi-variety, low-batch production.
Detection Results
Cold Solder Joint Detection
Accurately detect soldering defects such as insufficient solder and poor wetting.
Solder Bridging Detection
Accurately detect solder bridges between adjacent solder joints.
Missing weld detection
Quickly detect defects such as missing welds or exposed pads
Offset Detection
Precisely measure component position offset to ensure soldering quality
Application Areas
Technical Specifications
| Detection Accuracy | ±0.01mm |
| Detection Speed | ≤0.3s/point |
| Camera Resolution | 1200 megapixels |
| Test visual field | 220mm × 170mm |
| Applicable Plate Thickness | 0.4-6.0mm |
| Power Requirements | AC 220V 50Hz |
| Device Dimensions | 1200×900×160 mm |
| Device Weight | Approximately 350 kg |
Actual specifications are subject to the confirmed model documentation.
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